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1～30 件を表示 ／ 全 30 件
Minimizing development man-hours, industrial network embedded module.
Anybus CompactCom enables hardware development in one go, making multi-network deployment easy. It is an embedded module that can be selected from three implementation forms to match hardware and specifications.
Intel Pentium/Celeron N4200 series and Atom series
Intel Pentium/Celeron N4200 series and Atom series ● Intel Pentium/Celeron N4200 series and Atom SoC ● Qseven 2.1 specification ● Up to 16GB LPDDR4 onboard, up to 64GB eMMC onboard ● Supports HEVC/H.265, H.264 MPEG2 HW DECODE ● GbE, 3 PCIe x 1, 2 x USB3.0, 5 x USB2.0 ● Compatible with iManager WISE-PaaS/RMM and embedded software API
NVIDIA RTX 3000 Embedded equipped Type B+
NVIDIA RTX 3000 Embedded equipped Type B+
![SKY-MXM-RTX3000_02-_Square20220324141350[1].jpg](https://image.mono.ipros.com/public/product/image_sub/68c/2001559380/IPROS172411761215226908.jpg?w=280&h=280){kind=small}
Supports 4K screen output! Excellent in both power efficiency and cost performance.
The "PCOM-BA03GL" is a COM-Express Type 10 Mini module equipped with the Intel Atom x7000 series processor (Amston Lake). This architecture offers low power consumption ranging from 6W to 12W while supporting screen output at up to 4K resolution via LVDS, HDMI, eDP, and DP, operating at 3.6GHz during turbo boost, and includes PCI-Express 3.0 lanes and USB 3.2 Gen 2, all while accommodating an industrial extended operating temperature range of -40°C to 85°C. It can be utilized in various fields, including industrial automation, medical, and transportation. 【Features】 ■ Equipped with Intel Atom x7000E series processor ■ Onboard LPDDR5 SDRAM expandable up to 16GB ■ Onboard eMMC expandable up to 64GB ■ Low power consumption (6W to 12W) ■ Supports 4K screen output ■ Operating temperature range of -40°C to 85°C *For more details, please download the PDF or feel free to contact us.
Equipped with a high-power yet low-power consumption processor! A product that can be utilized for various applications.
The "WSC-M31" is a SMARC 2.1 module equipped with an Intel Amston Lake generation processor. It supports LPDDR5 memory and features a variety of interfaces. Additionally, it is compatible with PCI-Express Gen3 and supports a total of six USB ports. Please feel free to contact us if you have any inquiries. 【Features】 ■ Supports LPDDR5 memory ■ Equipped with a variety of interfaces ■ PCI-Express Gen3 compatible ■ Supports a total of six USB ports *For more details, please download the PDF or feel free to contact us.
NXP i.MX6 Cortex-A9 System on Module
The Digi ConnectCore 6N is an ultra-compact and highly integrated system on module (SOM) based on the NXP i.MX6 Cortex-A9 processor family. With a processor speed of up to 1.2GHz and fully interchangeable single/dual/quad-core types, the ConnectCore 6N offers scalable performance and a truly future-proof platform solution that includes certified 802.11a/b/g/n/ac and Bluetooth Low Energy, as well as Bluetooth 5.0 wireless connectivity. The low-profile surface mount design maximizes integration flexibility and significantly reduces design risk with a cost-effective and reliable form factor that enables optimal management even in the most challenging quad-core system configurations.
The VIA SOM-5000 module accelerates the development of advanced edge AI systems and devices.
The VIA SOM-5000 module, equipped with the new MediaTek Genio 700 octa-core processor, provides a flexible and feature-rich platform that reduces time to market for power-efficient smart home, retail, and industrial IoT systems and devices.
NVIDIA RTX PRO 500 Blackwell equipped embedded MXM GPU module
Compact AI Acceleration for Embedded Systems with Space Constraints The EGX-MXM-BW500 is an ultra-compact MXM 3.1 Type A module that delivers up to 294 AI TOPS of AI performance. It is optimized for embedded platforms with limited space, providing efficient AI inference, computer vision, and graphics acceleration in intelligent edge devices where compact size, thermal efficiency, and reliable performance are essential.
NVIDIA RTX PRO 2000 Blackwell equipped embedded MXM GPU module
The highest computational density in MXM Type A modules The EGX-MXM-BW2000, achieving up to 798 AI TOPS, maximizes AI computational density within the compact MXM 3.1 Type A form factor. It is designed for embedded AI systems that require significantly higher inference performance without increasing the size of the module, making it ideal for robotics, machine vision, and medical imaging applications.
High-performance embedded GPU module featuring NVIDIA Blackwell architecture and equipped with 24GB GDDR7.
Accelerating the next evolution of AI with the Aetina CoreEdge MX5000B-XA — equipped with NVIDIA RTX PRO 5000 Blackwell: The MX5000B-XA MXM 3.1 Type B GPU module integrates the NVIDIA RTX PRO 5000 Blackwell GPU and features the latest NVIDIA CUDA and ray tracing technologies. It delivers exceptional AI performance, large memory capacity, and high throughput, making it ideal for high-performance edge AI applications. Aetina ensures a 5-year product lifespan for this solution, guaranteeing long-term reliability and support. Unlocking next-generation AI performance for physical AI and humanoid robots: Designed to accelerate demanding edge workloads and advanced graphics processing, it targets multimodal AI, agent AI, simulation, 3D graphics, multi-scenario rendering, advanced generative AI, and complex real-time computational tasks.
How about revitalizing Okayama using IoT? We have examples of IoT applications and case studies available.
This document introduces the Okayama IoT Consortium "Everyone's IoT." It includes examples of IoT implementation and the hurdles of adopting IoT, starting with the Fourth Industrial Revolution. "Everyone's IoT" aims to lower the barriers to IoT adoption by bringing together different industries as one team to share challenges, materialize ideas, and leverage their areas of expertise. Our company is waiting for inquiries regarding the consortium and consultations about IoT implementation. [Contents (excerpt)] ■ Company Profile ■ Business Overview ■ Fourth Industrial Revolution ■ Examples of IoT Utilization ■ IoT Implementation Cases *For more details, please refer to the PDF document or feel free to contact us.
AI edge computing is possible! Introducing the SOM board equipped with the MediaTek i500 processor.
The "SY-I50-SOM" is an AIoT platform that incorporates the MediaTek i500 (MT8385) for AI/AR/VR applications. It supports advanced full HD multimedia encoding/decoding capabilities, as well as advanced AI features such as deep learning, neural network acceleration, and computer vision applications. Additionally, we offer an evaluation kit called "SY-I50-EVK (tentative)," which serves as a dedicated evaluation environment and development platform for the SY-I50-SOM. 【Features】 ■ SOM board equipped with MediaTek i500 processor ■ Capable of AI edge computing *For more details, please refer to the PDF materials or feel free to contact us.
70mm x 40mm! Modular and compact Qseven form factor.
We would like to introduce our product, the 'iW-RainboW-G34M/G37M-Q7'. This product features a 64-bit ARMv8 architecture and a product lifespan program of over 10 years. Additionally, it is equipped with IEEE 802.11a/b/g/n/ac Wi-Fi and Bluetooth 5.0. 【Features】 ■ i.MX 8M Mini ■ i.MX 8M Nano Q/QL/D/DL/S/SL CPU ■ 64-bit ARMv8 architecture ■ Product lifespan program of over 10 years ■ IEEE 802.11a/b/g/n/ac Wi-Fi *For more details, please refer to the PDF document or feel free to contact us.
Supports Cortex-A55 cores! Over 10 years of product lifespan program.
We would like to introduce the "iW-RainboW-G53M," which we handle. This product is an OSM-SE LGA module based on the Renesas G2UL, A3UL, or FIVE. It is equipped with a Renesas G2UL or A3UL SoC featuring a 64-bit ARMv8.2 A architecture. 【Features】 ■ Renesas G2UL or A3UL SoC ■ Renesas FIVE SoC ■ 1GB DDR4 memory (expandable based on chip availability) ■ Supports Cortex-A55 cores (G2UL and A3UL) ■ Supports Cortex-M33 core for RTOS (G2UL) *For more details, please refer to the PDF document or feel free to contact us.
Equipped with a high-performance quad-core Cortex-A53 CPU, dual Cortex-R5 CPUs, and Arm Mali-400MP2 GPU!
We would like to introduce the 'ZU15/ZU9/ZU6- Zynq UltraScale+ MPSoC System on Module iW-RainboW-G65M' that we handle. It offers 16 x GTH transceivers (up to 16.3Gbps) and various interfaces (such as Gigabit Ethernet, USB 2.0 OTG), and supports an operating temperature range of -20°C to +85°C. As a result, it is an ideal module for vertical markets such as industrial, medical, automotive, and aerospace. 【Features (partial)】 ■ Compatible with AU25P/20P/15P/10P ■ Up to 308K Logic cells & 141K LUTs ■ 16 channels of GTY transceivers up to 16.375Gbps ■ 72 LVDS Pairs and 66 SE PL IOs *For more details, please download the PDF or feel free to contact us.
効率的な処理、豊富なマルチメディア機能、実用的なエッジAI機能をコンパクトな組み込み設計で実現！
『SOG36P』は、効率的な処理、豊富なマルチメディア機能、 そして実用的なエッジAI機能をコンパクトな組み込み設計で実現する エントリーレベルのAIoTデバイス向けに設計された6nm SoM プラットフォームです。 本プラットフォームは、ヘキサコア(6コア)プロセッサを搭載し、 エッジGenAIをサポートしており、最大7.4TOPSのAI性能を実現。 これにより、開発者は組込み製品開発のための柔軟で強力な プラットフォームを活用できます。 4K60ディスプレイ、マルチカメラ、4Kビデオ、豊富なI/O、そしてAndroid またはLinux OSオプションをサポートする当製品は、スマートディスプレイ、 リテール製品、HMI、産業用組み込みアプリケーションに好適です。 【機能 (一部)】 ■Processer：MediaTek Genio360P ■CPU：2xArm Cortex-A76 2.0GHz、6xArm Cortex-A55 2.0GHz ■GPU：ArmMali-G57MC2 ※詳しくはPDFをダウンロードしていただくか、お気軽にお問い合わせください。
![[ODM/EMS Case Study] VE Proposal Example for Gear Units](https://image.mono.ipros.com/public/product/image/955/2000694755/IPROS83061193510545997088.png?w=280&h=280)
We have achieved a reduction of approximately 70% in component costs! We will propose specifications utilizing our expertise in circuit design and mechanical design!
Our company is engaged in the ODM and EMS business for electronic devices such as automotive equipment, consumer electronics, industrial equipment, and medical devices. We are actively responding to "VE proposals," including cost reduction of components in the development of electronic devices for automotive use. We can support everything from development, design, manufacturing, quality assurance, to evaluation, and we also cater to OEMs that specialize in technology provision. Please feel free to consult with us. 【VE Proposal Example: Rotational Control Using DC Motors】 Proposal Details: As an alternative to stepping motors used for rotational control such as angle adjustment and storage, we propose a combination of "DC motors," "Hall ICs," and "magnets." Results: Successfully achieved a reduction of approximately 70% in component costs! *For more details, please refer to the materials available for download in PDF format. Feel free to contact us as well. We are also currently holding an online exhibition where you can view our business offerings in more detail.
Core Ultra × COM Express, a compact high-performance module with 28W.
The NanoCOM-MTU is a COM Express Type 10 (mini size) module offered by AAEON, featuring an Intel Core Ultra (Meteor Lake generation) processor. It is designed to achieve high performance and low power consumption, enabling the construction of compact and flexible embedded systems.
Compact 2D scan engine – Industry-leading barcode scanner manufacturer RIOTEC
RIOTEC's 2D scan engine is a powerful and compact solution that caters to a wide range of applications, including industrial automation, warehouse management, and mobile data collection. It offers advanced technology for quickly and accurately scanning printed labels and barcodes on smartphone screens. The AI3250 2D scan engine is equipped with a hardware decoder, enabling fast and precise barcode reading. This engine is an ideal choice for industrial PDAs, tablets, data collectors, and other mobile devices. With a size of just 21.8 x 15.6 x 11 mm, it is extremely compact and can be easily integrated into limited spaces. Whether for 1D or 2D codes, the AI3250 guarantees reliable performance even in harsh environments. Please feel free to contact RIOTEC, and we will propose the appropriate solution tailored to your company's needs.
Compact high performance for next-generation edge AI.
Aetina offers a variety of small form factor (SFF) modules with a compact architecture, targeting applications that typically require high-performance computing in limited spaces. These SFF modules include mobile PCIe modules (MXM) and M.2 modules, proprietary evaluation expansion kits, and one-stop thermal services. The mobile PCI Express modules (MXM) feature compact commercial off-the-shelf (COTS) solutions. Aetina leverages cutting-edge NVIDIA GPUs and AI ASIC processors to deliver unmatched power efficiency and high-level computing capabilities. This enables the optimization of size, weight, and power (SWaP) for edge AI applications, making them ideal for use in embedded systems that require high performance.
A variety of communication modules that can be selected based on purpose and design method!
This module is a complete execution-type solution that integrates hardware and software. In addition to supporting five types of industrial network masters and twelve types of slaves, it also supports IoT communication (OPC UA, MQTT), achieving all communication environments that are supported in common with the host board and drivers. We can provide a one-stop solution for development and evaluation environments as well as network diagnostic environments. 【Product Lineup】 ■ General-purpose type with mechanical mount ■ Slave-only module with surface mount type advantageous for mass production ■ Slave-only module with DIL-32 socket type ■ Slide-in module compatible with PCI Express, interchangeable in the market *For more details, please refer to the PDF document or feel free to contact us.
A variety of interfaces including USB4! Capable of installing up to four DDR5-4800MT/s So-DIMMs.
The PCOM-B887 is a COM-HPC client module compatible with Intel Core Ultra200 socket type CPUs, with a size of C (160 x 120mm). It supports PCIe Gen5x16, PCIe Gen5x4, and PCIe Gen4. It features an integrated NPU for AI acceleration. Please feel free to contact us if you have any inquiries. 【Features】 ■ Compatible with Intel Core Ultra200 socket type CPUs ■ Supports PCIe Gen5x16, PCIe Gen5x4, and PCIe Gen4 ■ Can accommodate up to 4 DDR5-4800MT/s So-DIMMs ■ A variety of interfaces including USB4 ■ Integrated NPU for AI acceleration *For more details, please download the PDF or feel free to contact us.
![Embedded MXM Module [MXM-Axe]](https://image.mono.ipros.com/public/product/image/380/2000813670/IPROS19681542167471635987.png?w=280&h=280)
Intel Arc GPU equipped MXM 3.1 Type A
ADLINK's MXM-AXe offers up to 8 hardware ray tracing cores, 128 execution units, 4GB GDDR6, and a maximum TGP of 50W with 8x PCIe Gen4. It provides a 50W TGP and the industry's first full AV1 hardware encoding. This module, which significantly enhances graphics rendering, is key to adapting to next-generation graphics workloads. The MXM-AXe leverages Intel's established graphics ecosystem, which edge developers have enjoyed and trusted for years, including OpenVINO for AI and Intel OneAPI management tools. Rather than a new lineup of GPUs, it is designed to seamlessly transition from integrated graphics to discrete graphics as before. Supporting Intel Deep Link technology, the MXM AXe, when combined with 12th and 13th generation Intel Core processors, achieves even higher performance and power efficiency through automatic workload allocation between integrated GPU, discrete GPU, and CPU.
NVIDIA RTX PRO 4000 Blackwell equipped embedded MXM GPU module
High-performance AI and graphics for advanced edge systems The EGX-MXM-BW4000 combines powerful AI acceleration and advanced graphics performance in an MXM 3.1 Type B module, achieving up to 1,334 AI TOPS. This product, enhanced with GPU resources and memory bandwidth, is designed for demanding applications in computer vision, industrial AI, medical imaging, and real-time visualization.
It offers 8GB eMMC flash expandable up to 128GB and various interfaces!
The "Zynq UltraScale+ MPSoC (ZU7/ZU5/ZU4) 3U-VPX Plug-in Module iW-RainboW-G30V" is equipped with AMD Xilinx's ZU7/5/4 Zynq UltraScale+ MPSoC. Additionally, it provides up to 504K logic cells and 230K LUTs, along with 64-bit 4GB PS DDR4 RAM with ECC (expandable up to 8GB) and 16-bit 1GB PL DDR4 RAM (expandable up to 2GB). It also offers 8GB eMMC flash (expandable up to 128GB) and various interfaces (Gigabit Ethernet, USB 3.0, USB 2.0, PCIe Gen3, etc.). 【Features (partial)】 ■ 16bit, 1GB PL DDR4 RAM (Upgradable) ■ 8GB eMMC Flash (Upgradable) *For more details, please download the PDF or feel free to contact us.
高度なAIワークロード、先進のディスプレイ技術、そしてインテリジェントなエッジ処理をサポートします！
『SOG72』は、高度なAI機能、スケーラブルな処理能力、そして高い 電力効率を必要とするエッジコンピューティングアプリケーション およびスマート組み込みシステム向けに設計されたAIoT SoM プラットフォームです。 先進の組み込み開発向けに構築されたこれらのプラットフォームは、 シームレスな接続性、豊富なマルチメディアサポート、そして産業、 リテール製品、スマートホーム、商業環境における柔軟な統合性を 兼ね備えています。 高度なAIワークロード、先進のディスプレイ技術、そしてインテリジェントな エッジ処理をサポートする当製品は、コネクテッドデバイス、組み込みAI システム、そしてAIoT製品設計のための信頼性の高い基盤を提供します。 【機能(一部)】 ■Processer：MediaTek Genio720 ■CPU：2xArm Cortex-A78 2.6GHz、6xArm Cortex-A55 2.0GHz ※詳しくはPDFをダウンロードしていただくか、お気軽にお問い合わせください。
MEDIATEK GENIO700 equipped SMARC module opens new possibilities for embedded systems.
The "SOM-SMARC-Genio700" is a high-performance product equipped with a multimedia Arm processor and AI accelerator capabilities. It features an 8-core CPU and has an APU performance of 4 TOPS, with a guaranteed supply for embedded applications for ten years. The module complies with the SMARC standard and offers various I/O options. It provides users of SMARC modules in fields such as retail, healthcare, smart homes, and digital signage with a new replacement option. 【Features】 ■ Processor - 2x Arm Cortex-A78 @2.2GHz - 6x Arm Cortex-A55 @2.0GHz - Mali G57 MC3 GPU - AI Accelerator: Mediatek APU3.0 equipped Cadence *For more details, please refer to the PDF document or feel free to contact us.
NVIDIA RTX PRO 5000 Blackwell equipped embedded MXM GPU module
Ultimate Embedded GPU for High-Performance Edge AI The EGX-MXM-BW5000, achieving up to 1,824 AI TOPS, is the flagship model of this series. Equipped with up to 24GB of high-speed GDDR7 memory, it delivers exceptional AI inference and graphics performance for the most demanding embedded AI workloads. It is optimized for large language models (LLM), generative AI, multi-stream AI inference, and other compute-intensive edge AI applications.
![[July 15th Event] Invitation to the Web Seminar hosted by Rihyo Electro](https://image.mono.ipros.com/public/product/image/873/2000527528/IPROS78782146602228659352.png?w=280&h=280)
Everything you need to know about the FA machine platform! - From Intel CPUs to module products, hypervisors, and AI tools -
Rihyo Electro Co., Ltd. will hold a webinar titled "Everything You Need to Know About Platforms for FA Equipment! - From Intel CPUs to Module Products, Hypervisors, and AI Tools" on Wednesday, July 15, 2020. In this seminar, we will introduce the latest products from Congatec, which are optimal for FA equipment, as well as the latest information on Realtime Hypervisor, Windows 10 IoT Enterprise, Azure IoT Edge certification, and Intel embedded products and AI tools like OpenVINO, incorporating case studies related to FA and manufacturing industries. We invite you to register for this seminar. 【Event Overview】 ■ Date and Time: July 15, 2020 (Wednesday) 16:00 - 17:30 (Entry available 10 minutes before start) ■ Participation Fee: Free <Pre-registration required> ■ Venue: Webinar tool "Cocripo" (https://www.cocripo.co.jp/) ■ Registration Method: Registration can only be done through our company website. *For more details, please refer to the PDF document or feel free to contact us.
Smart inference with Jetson Orin NX - AI anywhere with a compact design of 152mm.
The BOXER-8652AI is a compact, fanless embedded AI system deployed as part of AAEON's AI@Edge solutions. It is equipped with the NVIDIA Jetson Orin NX module, providing powerful AI inference capabilities in a small form factor.
